HFE applications in Semiconductor
Cleaning
（1）Cleaning for silicon chips
Smaller and smaller chip sizes, increasingly complex structures, and concerns for safety and material compatibility make semiconductor cleaning and drying more challenging than ever before.
HFE, applied as pure solvent, azeotrope or co-solvent, can effectively remove particles and ion soils. Their low surface tension allow these liquids to penetrate tight spaces and thoroughly clean hard-to-reach areas. At the same time, HFEs are compatible with most structural materials. In many applications, they have become the safe and sustainable replacement for isopropyl alcohol (IPA), N-methylpyrrolidone (NMP) and other traditional solvents.
（2）Cleaning for FOUPs
HFE fluids can be used to clean the front opening universal pods (FOUPs) that hold silicon wafers in controlled environments. Performance is critical to prevent contamination of silicon chips. Superior and reliable cleaning of FOUPs and flip chips has made HFE the best choice in the semiconductor industry.
（3）Cleaning for semiconductor devices
HFE fluids can be used to clean semiconductor etching cavity and remove fluorine residues to replace traditional solvents such as isopropyl alcohol and acetone.
Drying
Due to their unique combination of properties, HFE fluids are excellent drying solutions after IPA Drying. Due to their lower surface tension, HFEs eliminate the problem of solvent getting trapped in a complex part because they can get into small gaps and blind holes and push the solvent out. The low boiling point of our products enables them to evaporate quickly—allowing parts to be processed faster, resulting in lower energy costs. They can evaporate quickly without leaving residue, and will not corrode delicate substrates.
Heat Transfer
HFE fluids are also used as heat transfer fluids in power semiconductors. They can be applied to cool dry etching devices, lithographic devices, probes, ion ejectors, etc. For replacing the existing perfluorocarbon (PFC) or perfluoropolyether (PFPE) heat transfer media, HFEs can reduce up to 99% of greenhouse gas emissions.
