Solvent Cleaning for Semiconductor
Cleaning for silicon chips
Smaller and smaller chip sizes, increasingly complex structures, and concerns for safety and material compatibility make semiconductor cleaning and drying more challenging than ever before.
HFE, applied as pure solvent, azeotrope or co-solvent, can effectively remove particles and ion soils. Their low surface tension allow these liquids to penetrate tight spaces and thoroughly clean hard-to-reach areas. At the same time, HFEs are compatible with most structural materials. In many applications, they have become the safe and sustainable replacement for isopropyl alcohol (IPA), N-methylpyrrolidone (NMP) and other traditional solvents.
Cleaning for FOUPs
HFE fluids can be used to clean the front opening universal pods (FOUPs) that hold silicon wafers in controlled environments. Performance is critical to prevent contamination of silicon chips. Superior and reliable cleaning of FOUPs and flip chips has made HFE the best choice in the semiconductor industry.
Cleaning for semiconductor devices
HFE fluids can be used to clean semiconductor etching cavity and remove fluorine residues to replace traditional solvents such as isopropyl alcohol and acetone.
